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High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

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High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair

Name: High Precision KSensor Mobile Phone BGA Rework Station for Chips Repair
Brand: HSTECH
Price: 1 USD

Quality High Precision K-Sensor Mobile Phone BGA Rework Station for Chips Repair for sale

Brand Name : HSTECH

Model Number : HS-700

Certification : CE

Place of Origin : China

MOQ : 1 set

Price : Negotiable

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 100 sets per month

Delivery Time : 7~9 work days

Packaging Details : Wooden package

Product Name : Mobile Phone BGA Rework Station

Warranty : 1 Year

Control : Touch screen

PLC : MITSUBISHI

Relay Brand : Schneider

Optoelectronic Switch : OMRON

Material : Aluminum Alloy

Condition : New

Thickness : 0.3 - 5mm

Signal : SMEMA

Application : Electronic Assembly

Color : Silver

Control System : PLC

OEM/ODM : Available

Total power : 2600W

Power Supply : AC220V

Air Pressure : 4-6bar

Mounting accuracy : ±0.01mm

Type : Automatic

Weight : 30KG

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5 Modes Stepping Motor CCD Color Align System Mobil Phone BGA Rework Station

Specification

Mobile Phone BGA Rework Station	Model:HS-700
Power Supply	AC 100V / 220V±10% 50/60Hz
Total power	2600W
Heater power	Top heater 1200W(Max), bottom heater 1200W(Max)
Electric material	Driving motor + smart temp. controller + color touch screen
Temperature control	high precision K-sensor+ closed loop control + independent temp.controller (the precision can reach ±1℃)
Sensor	1pcs
Locating way	V shape PCB support + external universal fixture + laser light for centering and positioning
Overall dimension	L450mmW470mmH670mm
PCB size	Max 140mm160mm Min 5mm5mm
BGA size	Max 50mm50mm Min 1mm1mm
Applicable PCB thickness	0.3 - 5mm
Mounting accuracy	±0.01mm
Weight of machine	30KG
Mount chip weight	150g
Working modes	Five: Semi-auto/Manual/Remove/Mount/Weld
Usage Repair	chips / phone motherboard etc

Features

1. The upper and lower heating zone, temperature precision control within ±1℃, which can heat up at the same time from the top of he component to the bottom of the PCB; 8 segment temperature control independently.
2. Hot air district heating for BGA and PCB at the same time, the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element.
3. Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system.
4. Temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved; temperature can be tested precisely through external measurement interface, curves can be analysed, set and correct on the touch screen at any time.

About Packaging

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